Strategic partnership kicks off with installation of EVG850 automated laser debonding system at the newly launched Center for Advanced CMOS and Heterointegration Saxony (CEASAX) Kicking off this ...

Wafer-to-wafer bonding is an essential process step to enable 3D devices such as stacked DRAM, memory-on-logic and future CMOS image sensors. At the same time, minimizing the dimensions of TSVs, which ...

Innovative materials are critical for maintaining integrity during advanced semiconductor manufacturing processes. Temporary bonding is being enabled by these new materials and is making a name for ...

Resonac is looking for development partners to establish a new debonding process, as well as to market the new temporary bonding film. In the front-end and back-end processes of advanced ...

The top three foundries plan to implement backside power delivery as soon as the 2nm node, setting the stage for faster and more efficient switching in chips, reduced routing congestion, and lower ...

“Our 200-mm EVG850LT system has been instrumental in helping us fulfill customer requirements for high-performance SOI wafers,” stated Prof. He ZhiQiang, CEO of SST. “As we look to advance our ability ...

New Monolithic Lens Molding (MLM) capability enables up to eight-megapixel-and-higher-resolution devices. CHIBA, Japan, Dec. 1, 2010 /PRNewswire/ -- SEMICON JAPAN -- EV Group (EVG), a leading supplier ...

Hybrid bonding is becoming more critical for advanced semiconductor packaging, thanks to its ability to enable high-density interconnects inside complex 3D assemblies. This approach involves the ...