Cohu to buy Tignis; NXP to acquire Aviva Links; $406M for GlobalWafers; $458M for SK Hynix; $1.3B for Silicon Box; advanced ...

Workflow-driven EDA software and concurrent engineering for the next generation of dedicated AI chips, boosting AI ...

Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial ...

Multi-die designs require advanced parasitic extraction, power analysis, and physical checks. Multi-die designs leveraging ...

An impedance analyzer is an electronic test instrument that measures the characteristic complex impedance curves of a ...

In today’s IC designs, effective power management through layout optimization is crucial for achieving PPA targets. This paper, written by Jeff Wilson, describes how the Calibre DesignEnhancer ...

More than just the processor needs to be defined for standard operating systems. Profiles help a little, but still not enough ...

Verification tools are getting faster and capacity is increasing, but they still can't keep up with the problem space.

3D DRAM can mean two things, one of which is already in production. “The most popular use case for 3D DRAM is HBM ...

Implementing inline inspection and adaptive process control systems, supported by machine learning algorithms, can provide ...

A new technical paper titled “Nonvolatile electrochemical memory at 600°C enabled by composition phase separation” was ...

Silicon lifecycle management has evolved greatly in the past five years, moving from novel concept to a key part of design ...