Veeco Instruments Inc. announced that PlayNitride, an industry leader in MicroLED technology, has qualified Veeco's Lumina® MOCVD system for production ... Veeco Instruments Inc. We search for ...

AI Technology (AIT) is pleased to announce the successful completion of its acquisition of Ormet Circuits Inc. (Ormet) from EMD Electronics, the U.S. and Canada Electronics ... AI Technology, Inc.

Littelfuse, Inc. announced the launch of its TPSMB Asymmetrical TVS Diode Series, the first-to-market asymmetrical transient voltage suppression (TVS) diode specifically ...

Master Bond Supreme 121AOND is a toughened epoxy system for bonding and sealing applications. It is a two component, heat curing system with a thixotropic paste consistency. ... Developed for medical ...

DENSO CORPORATION and onsemi announced that they are strengthening their long-term relationship to support the procurement of autonomous driving (AD) and advanced ... Semiconductor Packaging News is ...

Further to sureCore's recent announcement about its launch of a range of cryogenic IP following the successful evaluation of test chips in both 180 nm and 22nm process nodes, ...

ZEISS Group revenue increased to just under 11 billion euros (10.894 billion euros), (up 8% on the prior year) – EBIT 1,444 million euros (prior year: 1,686 million euros ... ZEISS partners with ...

SEMICON Korea 2025 will take place Feb. 19-21 in Seoul at the COEX offering a comprehensive look into AI-driven technological advancements and edge technologies ... SEMICON Japan opens at Tokyo Big ...

The U.S. Department of Commerce has urged Nvidia and distributors like Dell and Super Micro to investigate illegal semiconductor imports to China. This move highlights efforts to enforce export ...

Silicon lifecycle management (SLM) has quickly advanced, transforming chip design, manufacturing & operations. Industry giants NVIDIA & Amazon leverage SLM to boost reliability & power-performance ...

SK hynix secured $958 million in U.S. subsidies under the CHIPS Act for its Indiana-based AI memory packaging plant and R&D facility. The funding supports the chipmaker's $4 billion investment in next ...

WeEn Semiconductor introduces top-side-cooling SiC devices in TSPAK and TOLT packages, reducing thermal resistance by 17%-19%. These innovative components boost ...