Cohu to buy Tignis; NXP to acquire Aviva Links; $406M for GlobalWafers; $458M for SK Hynix; $1.3B for Silicon Box; advanced ...

Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial ...

Workflow-driven EDA software and concurrent engineering for the next generation of dedicated AI chips, boosting AI ...

Multi-die designs require advanced parasitic extraction, power analysis, and physical checks. Multi-die designs leveraging ...

An impedance analyzer is an electronic test instrument that measures the characteristic complex impedance curves of a ...

More than just the processor needs to be defined for standard operating systems. Profiles help a little, but still not enough ...

Implementing inline inspection and adaptive process control systems, supported by machine learning algorithms, can provide ...

Verification tools are getting faster and capacity is increasing, but they still can't keep up with the problem space.

In today’s IC designs, effective power management through layout optimization is crucial for achieving PPA targets. This paper, written by Jeff Wilson, describes how the Calibre DesignEnhancer ...

3D DRAM can mean two things, one of which is already in production. “The most popular use case for 3D DRAM is HBM ...

New pilot lines offer European innovators access to the most advanced semiconductor technologies for product development and ...

As integrated circuit (IC) designs continue to scale, the demand for efficient power management, performance optimization and ...