MRSI (Mycronic), a US-based industry leader in high-precision chip and die assembly solutions, has encountered challenges due to the US ban on advanced semiconductor production in China. Our expertise ...

TSMC and Nvidia Team Op on Silicon Photonics, CEO Jensen Huang Says: Summary Nvidia and TSMC have teamed up to advance silicon photonics, a promising low-power technology for opti ...

2024 was both a challenging year for us and one that pointed the way to the future. The political environment has partly been ...

In 2022, the CHIPS Act launched a $53 billion initiative to strengthen U.S. semiconductor manufacturing, spotlighting advanced packaging. Arizona emerged as a key player, with Amkor’s $2 billion ...

StratEdge has been a leader in the design and production of high-performance semiconductor packages since 1985, with a focus on developing components for compound semiconductors. All our packages are ...

The increasing demand for artificial intelligence (AI) processors and high-bandwidth memory (HBM) devices that can handle massive data processing is driving the industry's transition to chiplets.

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

The Device Research Conference (DRC), the longest running device research meeting in the world, has announced a Call for Papers for DRC 2025, the conference's 83rd anniversary. ... Semiconductor ...

Complete Probe Solutions is excited to announce a new feature for their APEX fully automatic wafer prober. The company has developed a Single Die Alignment option to address ... Complete Probe ...

ViTrox Technologies announced that it will exhibit in Booth #5667 at SEMICON China 2016, scheduled to take place March 15-17, 2016 at Shanghai New International ... We search for industry news so you ...

Imec has announced a significant milestone in silicon photonics with the successful demonstration of electrically-driven GaAs-based multi-quantum-well nano-ridge laser ... This week, at the 2024 IEEE ...