Cohu to buy Tignis; NXP to acquire Aviva Links; $406M for GlobalWafers; $458M for SK Hynix; $1.3B for Silicon Box; advanced ...

Workflow-driven EDA software and concurrent engineering for the next generation of dedicated AI chips, boosting AI ...

In today’s IC designs, effective power management through layout optimization is crucial for achieving PPA targets. This paper, written by Jeff Wilson, describes how the Calibre DesignEnhancer ...

Alphawave Semi is positioned to pioneer this effort with an HBM4 memory controller portfolio and recently announced 3nm, 24 Gbps die-to-die UCIe IP subsystem delivering 1.6 TB/s of bandwidth. In ...

Heterogenous integration is pushing chip and package designers to consider multi-physics effects as early as the initial ...

An impedance analyzer is an electronic test instrument that measures the characteristic complex impedance curves of a ...

Verification tools are getting faster and capacity is increasing, but they still can't keep up with the problem space.

What a year it’s been for Arteris! Reflecting on 2024, the company achieved exciting milestones and breakthroughs that pushed ...

Multi-die designs require advanced parasitic extraction, power analysis, and physical checks. Multi-die designs leveraging ...

As integrated circuit (IC) designs continue to scale, the demand for efficient power management, performance optimization and ...

Experts At The Table: The automotive ecosystem is in the midst of an intense evolution as OEMs and tiered providers grapple with how to deal with legacy technology while incorporating ever-increasing ...

More than just the processor needs to be defined for standard operating systems. Profiles help a little, but still not enough ...